Precision Alloys
The transition from silicon-based power electronics to SiC and GaN technologies is fundamentally reshaping material requirements in advanced electronic packaging. Traditional low-CTE alloys alone are no longer sufficient to meet the simultaneous demands of thermal conductivity, reliability, electrical performance, and thermal stress management.
KERRIUM is actively expanding its focus beyond conventional precision alloys toward emerging functional material systems for advanced power electronics and thermal management applications, particularly the developments in engineered composite systems including:
- Cu-Mo composites
- Cu-W materials
- AlSiC metal matrix composites
- Advanced MMC structures
In the meantime, the rise of high-frequency SiC and GaN switching systems is accelerating demand for next-generation magnetic materials with lower core losses and improved high-frequency performance. Areas of technical interest of KERRIUM include:
- Nanocrystalline alloys
- Soft magnetic composites (SMC)
- Advanced Fe-based magnetic systems
We understand that all these materials are increasingly relevant in high-frequency power conversion, EMC optimization, and compact magnetic component design.
KERRIUM is progressively expanding toward application-oriented material engineering perspectives.
Our current focus includes:
- Exploring emerging functional material systems
- Developing technical partnerships
- Expanding material and application knowledge
- Supporting next-generation electronic and thermal management applications
We believe the future of advanced electronics will increasingly rely on integrated material architectures rather than single-alloy solutions alone.
KERRIUM bridges traditional precision alloy expertise with the emerging world of functional composite materials and advanced thermal management technologies.